CONTAMINATION CONTROL IN MICROELECTRONICS MANUFACTURING
Kiyoshi Mori (Du Tan Nguyen)
Sony Semiconductor
San Antonio, TX 78245 USA
E-Mail: [email protected]
Abstract
In today's VLSI manufacturing line, millions of microchips are built
every month, but it is not certain that all these chips can be sold
to the customers. In every facilities, there is a considerable number
of chip that have been rejected at the electrical test after
fabrication. Particles and many other types of contamination in the
production line are found to be the dominant failure causes.
The effects of contamination on device function and reliability are
becoming even more critical in the future more advanced technologies.
The success of a Semiconductor Fab is not only dependent upon process
capability but also heavily dependent upon the contamination control.
In addition to maintaining a controlled process, a Semiconductor
engineer must learn to reduce the contamination level at his process
step. This paper provides a summary of how to monitor and control the
contamination level to achieve a high yield in microelectronics
manufacturing.
MICRO STRUCTURE AND MAGNETIC PROPERTIES OF AMORPHOUS AND NONOCRYSTALLINE Fe76.5-x Cu1 Nbx Si13.5 B9
Duong Hong Vo, R. Grossinger, R. Sato Turtelli
Institute of Experiental Physics
Vienna University of Technology
Wiedner Hauptstrasse 8-10/131
A-1040, Wien, AUSTRIA
Abstract
The changes of the crystallization process and magnetic behaviour varying
the Nb content as well as the annealing temperature in the range of 480-530oC
for amorphous material based on the system FeCuNbSiB were studied. After
heat treatment a material with two-phase structure: α-FeSi
crystallites with diameters of about 6-13 nm embedded in the amorphous
matrix was formed except the samples with Nb=5 annealed below 530oC.
The structural results show that the increase of the Nb concentration leads
a shift of the crystallization onset to higher temperatures. The magnetic
hardening was observed in the temperature dependence of the coercivity
revealing that the exchange interaction between nanocrystalline grains
decreases with temperature. The effective magnetostriction as a function
of temperature was carefully investigated. Nevertheless, the compensation
temperature of the saturation magnetostriction was not found for all
measured samples. Two mechanisms were proposed to discuss this behaviour.
A NOVEL TECHNIQUE FOR IN SITU MEASUREMENT OF WATER AT THE POLYMER/SUBSTRATE INTERFACE
Tinh Nguyen & Eric Byrd
National Institute of Standards and Technology, Maryland, USA
Abstract
In situ and quantitative information on the water layer at the
polymer/substrate interface is crucial for understanding and preventing
the corrosion and delamination of polymer-coated metals. A technique,
based on a two-layer model derived from internal reflection theory, has
been developed for measuring in situ the thickness and amount of the
water layer at the polymer/substrate interface. The technique gives new
insight into the processes by which water degrades the polymer/substrate
bonds. In this technique, a transparent or an opaque polymer film of
sufficient thickness is applied to a prism with or without a thin
metallic film, which is used as the substrate. A water chamber is
attached to the polymer-coated specimen. After adding water to the
chamber, Fourier transform infrared-multiple internal reflection
(FTIR-MIR) spectra are taken automatically at specified time intervals
without disturbing the specimens or the instrument. Water uptake in the
polymer film and FTIR-MIR spectra of water on the polymer-free substrate
are measured and used for the analysis. Examples of clear and pigmented
polymer films on several types of untreated and surface modified
substrates are given to demonstrate the technique. Results of water
accumulation at the polymer film/iron interface with and without applied
electrical potentials are given. In addition to measuring water at the
polymer/substrate interface, the technique provides a means for studying
the transport of water through a film adhered to a substrate. Information
on water at the interface and its transport properties through polymer
films applied to a substrate is valuable for interpreting corrosion,
adhesion loss and delamination of polymer coating systems and for
developing models for use in predicting the service lives of protective
coatings.
PARALLEL CONTROL SYSTEM FOR HIGH SPEED MANUFACTURING MACHINE
Gunter Pritschow and Tang Long Tran
Institute of Control Technology for Machine Tools and Manufacturing Units
Prof. Dr. -Ing Dr.h.c. Gunter Pritschow
Seidenstraße 36, 70174 Stuttgart, GERMANY
E-Mail: [email protected]
Abstract
In a research project it is expected that a new type of machine will
play a major role towards improving path accuracy and increasing manufacturing
velocity and dynamics in laser production. For that purpose, a machine
with new kinematics has been designed and built at the University of
Stuttgart. As part of this research programmer, a new controller architecture
has been developed to achieve the above aims. The new architecture is based
on an open control system which makes a parallelization of the control system
possible. The control system is divided into two parts running on two
separate processors: the main components of the system operate on a powerful
RISC processor while the position controller is computed by a digital
signal processor. The communication between these two processors is realized
with a parallel bus. Due to this architecture, an interpolation cycle time
of 0,5 ms is possible, which is an important requirement for better path
accuracy.